Nanoveu’s ECS-DoT Chip Extends Drone Flight Time by One-Third

Nanoveu Limited has accelerated its commercial and technological momentum with a $3.02 million capital raise, a breakthrough 33% increase in drone flight time using its edge-AI chip, and progress toward a U.S. OTCQB listing.

  • Raised $3.02 million to fast-track ECS-DoT chip and product commercialization
  • Achieved 33% simulated drone flight time improvement without hardware changes
  • Initiated U.S. OTCQB market listing to expand investor access
  • Opened EyeFly3D showroom in Shenzhen and filed key patents
  • Advanced Nanoshield Solar trials showing 5-6% energy output gains
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Strategic Capital and Leadership Moves

Nanoveu Limited (ASX – NVU) has marked a pivotal quarter with a successful $3.02 million capital raise, including a significant $810,000 contribution from management and directors. This funding is earmarked to accelerate the commercial rollout of its ECS-DoT edge-AI chip, EyeFly3D 3D visualisation platform, and Nanoshield Solar coating trials. Complementing this financial boost, the company strengthened its leadership team by appointing semiconductor veteran Scott Smyser as VP of Sales & Marketing and Dr. Yehia Ismail, a globally recognized expert, as Strategic Advisor, signaling a clear intent to scale aggressively, especially in the U.S. market.

Technological Breakthroughs in Edge-AI and Drone Performance

Nanoveu’s subsidiary EMASS achieved a remarkable 33% increase in simulated drone flight time using the ECS-DoT chip, without any modifications to the drone’s battery or airframe. This leap in power efficiency and AI processing at just 1 milliwatt consumption underscores the chip’s potential to revolutionize autonomous drone applications across logistics, agriculture, and defense sectors. Building on this success, phase 2 drone trials have commenced, testing the chip in heavier drones and complex environments, with results anticipated in August 2025.

Advancing Silicon Fabrication and Developer Ecosystem

Nanoveu is progressing its ECS-DoT chip development from simulation to silicon fabrication by partnering with the Centre of Nanoelectronics and Devices (CND) in Cairo, leveraging TSMC’s advanced 16nm FinFET process. This transition promises a more compact, power-efficient, and commercially viable chip architecture. Additionally, EMASS launched a plug-and-play developer kit to accelerate adoption, featuring real-time AI acceleration and sensor fusion, bridging the gap between R&D and real-world applications.

Expanding Commercial Footprint with EyeFly3D and Nanoshield Solar

On the commercial front, Nanoveu opened its first EyeFly3D showroom in Shenzhen, showcasing glasses-free 3D display technology enhanced by the integration of the ECS-DoT chip. The company also filed new patents protecting next-generation protective film structures aligned with flagship mobile devices. Meanwhile, Nanoshield Solar coatings demonstrated a consistent 5-6% increase in energy output in photovoltaic trials in Dubai and are undergoing large-scale testing at Morocco’s Noor-2 Concentrated Solar Power plant, positioning Nanoveu well in the renewable energy sector.

US Market Entry and Financial Outlook

Nanoveu has initiated its listing process on the U.S.-based OTCQB market, aiming to broaden North American investor access and enhance global visibility. The company ended the quarter with $2.07 million in cash and has since raised an additional $2 million to support ongoing development and commercial activities. With a clear roadmap targeting silicon tape-out in early 2026 and multiple product launches planned, Nanoveu is poised for accelerated growth in the second half of 2025.

Bottom Line?

Nanoveu’s blend of strategic funding, technological innovation, and global expansion sets the stage for a transformative year ahead.

Questions in the middle?

  • How will the upcoming ECS-DoT silicon tape-out impact Nanoveu’s commercial timelines?
  • What traction will Nanoveu gain from its OTCQB listing in terms of U.S. investor interest?
  • Can EyeFly3D’s integration with ECS-DoT and new software upgrades drive significant market adoption?