Nanoveu, via its subsidiary EMASS, has expanded its U.S. sales network with key manufacturer representatives to fast-track adoption of its ECS-DoT ultra-low power Edge AI chip across critical OEM hubs.
- Appointment of manufacturer sales reps in West Coast, Northeast, and Midwest U.S.
- Focus on autonomous drones, smart wearables, edge healthcare, industrial IoT, and defense sectors
- Sales reps bring complementary tech expertise and no competing Edge AI SoCs
- Ongoing phase two drone evaluation program with promising efficiency gains
- Plans for further expansion into Central and Northern Europe and 16nm chip tape-out in Q4 2025
Strategic Sales Network Expansion
Nanoveu Limited (ASX, NVU), through its wholly owned subsidiary EMASS, has taken a significant step to accelerate the commercialisation of its ECS-DoT ultra-low power Edge AI System-on-Chip (SoC) by appointing key manufacturer sales representatives across major U.S. OEM hubs. These appointments cover critical regions including the West Coast, Northeast, and Midwest, positioning EMASS to engage more effectively with leading Original Equipment Manufacturers (OEMs) designing next-generation products.
The newly onboarded sales reps; TAARCOM, Haper & Two, and IRI; bring deep-rooted relationships and expertise in complementary semiconductor technologies such as sensors and communications ICs. Importantly, none represent competing Edge AI SoCs, allowing EMASS to be positioned as the exclusive solution in this category within their territories.
Targeting High-Growth Edge AI Applications
The ECS-DoT chip is tailored for applications demanding ultra-low power consumption and real-time sensor fusion, including autonomous drones, smart wearables, edge healthcare devices, industrial IoT, and robotics/defense. Early customer engagements are already underway, with OEMs actively evaluating the chip’s capabilities. The sales representatives have expressed enthusiasm, noting the ECS-DoT’s advantages in power efficiency and compact design, which are critical for these markets.
EMASS is also advancing phase two of its structured drone evaluation program, which has demonstrated simulated increases in drone flight time; a key metric for autonomous drone OEMs. This phase includes testing across multiple drone platforms and environmental conditions, validating the chip’s robustness and energy-aware autonomy. The results, expected soon, could be pivotal in driving further design wins.
Global Commercialisation and Future Outlook
Beyond the U.S., EMASS is in advanced talks to expand its sales representative network into Central and Northern Europe, aiming to strengthen its global footprint. This strategic scaling allows EMASS to accelerate market coverage and customer engagement without the overhead of building a direct sales force region by region.
Looking ahead, EMASS targets early design wins with global OEMs for its current 22nm ECS-DoT solution while preparing for the tape-out of a more advanced 16nm chip scheduled for Q4 2025. The company’s leadership underscores that power efficiency is becoming the new benchmark for performance in edge AI, and with a robust sales pipeline and validated technology, EMASS is well-positioned to lead disruption in this fast-evolving market.
Bottom Line?
Nanoveu’s expanded sales network sets the stage for accelerated Edge AI adoption, but upcoming drone evaluation results will be critical to sustaining momentum.
Questions in the middle?
- How will the phase two drone evaluation results impact OEM design-win momentum?
- What is the timeline and expected market impact of the 16nm ECS-DoT chip tape-out?
- How effectively can EMASS scale its sales network beyond the U.S. into Europe and other regions?