Nanoveu’s 16nm ECS-DoT Chip Advances Rapidly with $7.5M Funding Boost

Nanoveu’s Capital Raise Strengthens Edge-AI Ambitions

Nanoveu Limited (ASX, NVU) has successfully secured firm commitments to raise A$7.5 million through a placement aimed at accelerating the commercialisation of its EMASS ECS-DoT system-on-chip (SoC) technology. Priced at $0.088 per share, the raise includes free attaching options exercisable at $0.15 over three years, signalling investor confidence in Nanoveu’s next-generation semiconductor roadmap.

The funds will primarily support the critical 16nm tape-out phase of the ECS-DoT chip, live drone validation programs, and the scaling of EMASS’s commercial SoC platform. This capital injection also bolsters Nanoveu’s balance sheet to advance complementary technologies such as EyeFly3D glasses-free 3D displays and Nanoshield solar coatings, alongside general working capital needs.

Rapid Progress on 16nm ECS-DoT Chip

EMASS has impressively delivered the final GDS file for the 16nm ECS-DoT SoC into the TSMC/IMEC manufacturing workflow within approximately six months from architecture to final design. This pace is notably faster than typical advanced-node semiconductor development cycles, positioning Nanoveu well to shorten the timeline from design to scalable silicon production.

Technical verification and bug-checking are underway as the chip moves towards light-mask preparation and tape-out readiness. This milestone transforms the ECS-DoT from a conceptual design into a manufacturable silicon asset, enhancing customer engagement and commercial prospects.

Live Drone Validation to Confirm Endurance Gains

In parallel, Nanoveu is advancing a live drone validation program in collaboration with a specialist U.S. drone firm. Building on Phase 2 simulation results that demonstrated over 50% endurance improvements across various drone platforms, the live testing aims to confirm these gains under real-world conditions. Early simulation data showed headline endurance increases of up to 80% for quadcopters and 85% for octocopters without hardware modifications.

These validation efforts are critical to securing original equipment manufacturer (OEM) and system integrator interest, potentially unlocking significant market opportunities in industrial and infrastructure applications.

Strategic Partnerships and Global Expansion

Nanoveu’s momentum is further supported by strategic collaborations with Arrow Electronics and Semtech, facilitating accelerated go-to-market execution through global distribution networks and engineering support. The integration of ECS-DoT with long-range, low-power LoRa connectivity enhances its appeal for IoT and edge computing markets.

The company is also expanding its sales presence in the U.S. and Europe, aiming to broaden access to major electronics markets and customers. Directors have committed to participate in the placement with $120,000, pending shareholder approval, underscoring management’s confidence in the company’s trajectory.