Nanoveu Advances Edge AI with 16nm ECS-DoT SoC Tape-Out at TSMC

Nanoveu’s Next-Gen Edge AI Chip Enters Production

Nanoveu Limited’s wholly owned subsidiary, EMASS, has reached a pivotal milestone with the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC). This ultra-low-power Edge AI chip has now entered fabrication at Taiwan Semiconductor Manufacturing Company (TSMC), signalling a critical transition from design to production silicon. The move to a 16nm process node represents a significant technical achievement, scaling up from the company’s existing 22nm ECS-DoT platform.

Enhanced Performance Without Compromising Power Efficiency

The 16nm ECS-DoT SoC brings several architectural improvements, including increased logic density and expanded on-chip SRAM, which support more complex AI workloads while preserving the ultra-low-power operation essential for edge devices. Notably, the chip integrates a Bluetooth Low Energy subsystem directly on-chip, reducing the need for external components and simplifying device design. Additional enhancements include a dedicated AI acceleration module for object detection and the introduction of a floating-point unit to accelerate mixed-precision AI and digital signal processing tasks.

Seamless Software Compatibility and Market Validation

One of the standout features of the 16nm ECS-DoT is its full software and workflow compatibility with the earlier 22nm generation. This continuity allows developers and customers to scale their applications without redesigning platforms or toolchains, easing adoption and accelerating time to market. The existing 22nm ECS-DoT SoC is already commercially available and integrated into devices across wearables, industrial sensing, asset tracking, and smart infrastructure, providing a proven foundation for the new generation.

Strategic Alignment with Nanoveu’s Atoms-to-Apps Vision

This development aligns closely with Nanoveu’s Atoms-to-Apps philosophy, which integrates application requirements, silicon architecture, and system deployment into a unified approach. Dr. Mohamed M. Sabry Aly, EMASS founder and Nanoveu director, emphasised that the tape-out validates years of architectural decisions and positions the company to support a broader range of always-on edge intelligence applications without compromising energy efficiency.

Looking Ahead

As the 16nm ECS-DoT progresses through fabrication and silicon validation, Nanoveu is poised to deepen its footprint in the rapidly growing edge AI market. The company’s ability to deliver advanced, energy-efficient AI processing at the edge could open new opportunities across multiple industries, from consumer wearables to industrial IoT.