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dorsaVi Clears Material Hurdle for 22nm RRAM Commercialisation
10:00am on Thursday 1st of January, 1970 AEST
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Technology
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dorsaVi Clears Material Hurdle for 22nm RRAM Commercialisation
10:00am on Thursday 1st of January, 1970 AEST
Key Points
Three RRAM stacks pass commercial foundry BEOL compatibility
180nm test chip tape-out targeted for Q3 2026
22nm design phase to start in H2 2027
Compute-in-memory integrated on 256Kb RRAM array
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