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Adisyn takes graphene from lab coupons to a full 200mm wafer

Technology By Sophie Babbage 4 min read

Adisyn has identified graphene at all 12 sampled locations on a full 200mm wafer, moving its low-temperature deposition platform beyond 1cm² laboratory coupons. The ASX-listed technology company ended September with A$14.4 million in cash and no debt, but commercial qualification remains ahead.

  • Graphene deposited below 300°C across a 200mm wafer
  • Independent Raman spectroscopy and TEM testing found graphene at all 12 sampled locations
  • Two additional US patent applications allowed
  • A$14.356 million cash balance and no debt at 30 September
  • Next phase targets repeatability, reliability, device integration and larger wafer formats

Graphene reaches industrial-scale 200mm wafer

Adisyn Ltd (ASX:AI1) has moved its graphene technology from small laboratory samples to a full 200mm semiconductor wafer, a step the company says came well ahead of its internal development expectations. The material was deposited below 300°C across a wafer with a surface area of approximately 314cm², roughly 300 times the size of the previously demonstrated 1cm² coupon.

“Representative Raman spectroscopy results from three sampled locations.”Caption and image © Adisyn Ltd. From “Quarterly Activities/Appendix 4C Cash Flow Report”, 29 Oct 2026.

Independent testing using Raman spectroscopy and transmission electron microscopy identified graphene at all 12 sampled locations. The sampling pattern covered north, south, east and west positions across the wafer, while representative testing supported the presence of a continuous layer with the expected thickness for graphene. The result extends the process demonstrator, but it is not yet evidence of commercial production or customer qualification.

The milestone builds on Adisyn’s earlier repeatable sub-300°C deposition, which was demonstrated on 1cm² coupons. The company says the 200mm result now provides a basis for further process development, device integration testing and potential joint development programs with semiconductor manufacturers.

Repeatability and device integration remain the test

Adisyn is now assessing uniformity, defects, repeatability and initial reliability across additional deposition runs. It also plans to pursue device integration testing, technical engagement with prospective industry partners and development work directed towards larger wafer formats, including the 300mm sizes used in advanced artificial intelligence, high-performance computing and memory applications.

The company identifies licensing, joint development and process or materials supply as possible commercial models. None of those arrangements is reported as contracted in this announcement. The significance of the wafer result therefore rests on whether the process can be repeated with acceptable defect levels and reliability, and whether semiconductor manufacturers are prepared to integrate it into development programs.

Patent coverage expands beyond metallic surfaces

Two additional US patent applications were allowed during the quarter. One covers graphene-coated three-dimensional surfaces and product characteristics including uniform conformal coatings on complex geometries. The company says the claims are directed to the end product rather than being limited to a particular manufacturing method.

The second allowed application covers methods for depositing graphene directly onto non-metallic surfaces, including semiconductor dielectrics, at temperatures below 400°C. It extends the company’s intellectual property position beyond metallic interconnects, following the US dielectric patent allowance reported in September.

Cash position supports the next development phase

Adisyn held A$14.356 million in cash and cash equivalents at 30 September and reported no debt. Customer receipts were A$1.755 million for the quarter, while net cash used in operating activities was A$1.029 million. Revenue of A$1.76 million was primarily generated by Adisyn Services, the managed IT and cybersecurity business serving Australian small and medium-sized enterprises and defence customers.

The quarterly cash position gives the company reported funding of nearly 14 quarters when measured against the period’s operating cash use. That calculation is mechanical and may not capture the cost of expanded wafer runs, device integration, reliability work or any future commercialisation effort. Leadership is also changing: Kevin Crofton became Executive Chairman during the quarter, while Ephraim Koltin was appointed Incoming CEO of 2D Generation after quarter end and is due to take over from Arye Kohavi on 30 November.

Bottom Line?

The 200mm wafer result is a meaningful scale milestone, but the investment case now depends on repeat runs, defectivity, reliability and evidence that semiconductor partners will move from technical discussions to funded integration programs.

Questions in the middle?

  • Can Adisyn reproduce the wafer-wide graphene coverage with consistent defect and uniformity data across multiple runs?
  • When will device integration and reliability testing produce results that semiconductor manufacturers can evaluate commercially?
  • Can Adisyn Services continue funding graphene development while the company progresses towards larger wafer formats and a new 2D Generation leadership structure?

Sources