4DS Memory Advances 20nm ReRAM Tech, Secures $6M Capital Boost
4DS Memory Limited reports successful testing of its 60nm memory cells and progresses toward 20nm technology, alongside a $6 million capital raise and a new design partnership with Infineon.
- Successful characterization of Fifth Platform Lot with 60nm memory cells
- Ongoing development of Sixth Platform Lot targeting 20nm memory cells
- Design Agreement signed with Infineon for custom ReRAM test chip
- Capital raising of $6 million via placement plus $2 million share purchase plan
- Cash position at $4.6 million with operational expenditure focused on R&D and partnerships
Technical Progress on Memory Cell Scaling
4DS Memory Limited has marked a significant milestone in its semiconductor technology development with the successful completion of testing on its Fifth Platform Lot, featuring 60nm memory cells. This achievement, announced in January 2025, validates key process optimizations that are critical for the company’s ambitious goal of scaling down to 20nm memory cells in the upcoming Sixth Platform Lot.
The Fifth Platform Lot, manufactured by imec and shipped to 4DS’s Fremont facility in October 2024, was designed to replicate and refine the unique characteristics observed in the previous Fourth Platform Lot. The testing phase identified essential process learnings in memory cell array patterning, etching, and memory stack adjustments, which are now being integrated into the Sixth Platform Lot’s design. This next phase aims to produce memory cells nine times smaller in area, positioning 4DS’s Interface Switching ReRAM technology as a potential generational leap in non-volatile memory.
Strategic Partnership with Infineon
In a strategic move to accelerate commercialization, 4DS entered into a Design Agreement with Infineon Technologies in December 2024. Under this 15-month contract valued at US$4.5 million, Infineon will allocate resources to develop a custom ReRAM memory test chip tailored to 4DS’s specifications. This collaboration addresses limitations identified in the universal megabit platform previously used, enabling a bespoke memory platform optimized for 4DS’s unique technology.
The partnership with Infineon, one of the world’s top semiconductor manufacturers, not only brings engineering expertise but also signals industry confidence in 4DS’s technology roadmap. The upfront payment of US$1.5 million and subsequent monthly payments underscore the company’s commitment to advancing its memory platform capabilities.
Capital Raising to Support Growth
To fund ongoing development and operational needs, 4DS successfully raised $6 million through a placement to institutional and high-net-worth investors, followed by a $2 million share purchase plan for existing shareholders. The placement shares were issued at $0.036 each, representing a discount to recent trading prices, and included attaching options exercisable at the same price until February 2028.
Bell Potter acted as sole lead manager, receiving a 6% fee and 12 million advisor options. The capital injection is earmarked for working capital, the Infineon design agreement, continued collaboration with imec, and general corporate expenses. As of December 31, 2024, 4DS held $4.625 million in cash, down from $6.312 million the previous quarter, reflecting steady investment in R&D and strategic partnerships.
Industry Engagement and Outlook
4DS’s leadership has been active in industry forums, with Chief Strategic Officer Peter Himes presenting at Semiconductor Australia 2024, highlighting the company’s role in Australia’s deep-tech ecosystem. Executive Chairman David McAuliffe’s recent US visit facilitated the Infineon agreement, underscoring the company’s global engagement strategy.
Looking ahead, the successful fabrication and analysis of the Sixth Platform Lot in the first half of 2025 will be a critical test of 4DS’s ability to scale its technology. If successful, it could position the company at the forefront of next-generation memory solutions, addressing the growing demands of AI and compute-intensive applications.
Bottom Line?
4DS’s progress toward 20nm ReRAM and strategic Infineon partnership set the stage for a pivotal 2025.
Questions in the middle?
- Will the Sixth Platform Lot successfully deliver functional 20nm memory cells as anticipated?
- How will the custom Infineon-designed test chip accelerate 4DS’s path to commercialization?
- What market adoption challenges might 4DS face as it scales its Interface Switching ReRAM technology?
