Latest Iot News

Nanoveu Limited has successfully raised $7.38 million through a strategic placement, advancing its position in advanced semiconductor and material sciences. The capital injection supports ongoing development of its innovative AI-driven SoC solutions and antimicrobial technologies.

Nanoveu’s subsidiary EMASS has successfully taped out its next-generation 16nm ECS-DoT ultra-low-power Edge AI system-on-chip, now entering production at TSMC. This milestone marks a significant step in scaling their proven 22nm platform to deliver enhanced performance and integration for always-on AI applications.

Nanoveu Limited has raised A$7.5 million through a strategic placement to accelerate the commercial rollout of its cutting-edge EMASS ECS-DoT semiconductor technology, including a rapid 16nm chip tape-out and live drone validation.

FlexiRoam has secured a key partnership to provide AI-enhanced connectivity for Malaysia’s national welfare initiative, supporting over 8 million recipients and marking a strategic step into mission-critical government infrastructure.

Simble Solutions has acquired exclusive rights to a cutting-edge 3D zinc oxide nanosensor technology and completed a $2.5 million placement, positioning itself to expand its IoT platform into new safety and environmental monitoring markets.

Weebit Nano has raised its FY26 revenue guidance to a minimum of $10 million following the signing of multiple IP licensing agreements with semiconductor fabs and product companies.

Weebit Nano has inked a long-term licensing deal with semiconductor giant Texas Instruments to integrate its advanced ReRAM technology into TI’s embedded processing chips, marking a significant step for next-generation memory solutions.

Nanoveu Limited has announced the tape-out of its next-generation ECS-DoT 16nm integrated circuit, alongside key collaborations with Arrow Electronics and Semtech, signaling a strong push into the ultra-low-power Edge AI market.

Nanoveu’s subsidiary EMASS has completed the design phase of its cutting-edge 16nm ECS-DoT Edge AI system-on-chip, moving closer to fabrication and silicon validation that could redefine ultra-low-power AI at the edge.

Nanoveu’s subsidiary EMASS has teamed up with Semtech to integrate ultra-low-power AI with long-range LoRa connectivity, promising smarter, battery-efficient IoT devices for industrial and smart city applications.

X2M Connect has secured a software development contract with Azbil Kimmon to digitise Japan’s vast water meter infrastructure, marking a strategic expansion beyond its existing gas monitoring services.

DorsaVi reports significant progress in its resistive RAM (RRAM) development, optimizing memory technology for integration with neuromorphic computing at the 22nm technology node. This advancement positions the company to deliver energy-efficient edge-AI solutions for wearables, robotics, and industrial safety.