Latest 3d Content News

Nanoveu Limited showcased its cutting-edge EMASS semiconductor technology at the Pitt Street Research Semiconductor Conference 2026, spotlighting its ultra-low-power AI chips designed for next-gen smart devices and drones.

Nanoveu Limited has successfully raised $7.38 million through a strategic placement, advancing its position in advanced semiconductor and material sciences. The capital injection supports ongoing development of its innovative AI-driven SoC solutions and antimicrobial technologies.

xReality Group (XRG) has reported robust growth driven by its flagship Operator XR training system, securing a landmark $5.7 million contract with the Texas Department of Public Safety and unveiling ambitious plans for new product launches and global expansion.

Nanoveu Limited showcased its cutting-edge EMASS semiconductor technology at the Ignite Investment Summit in Hong Kong, highlighting a new ultra-low-power AI chip designed to revolutionize edge computing across multiple industries.

Nanoveu Limited reveals significant progress in its ECS-DoT system-on-chip technology, showcasing a 60% average increase in drone flight endurance and advancing production with TSMC’s 16nm process. The company’s latest investor webinar highlights its growing OEM partnerships and disruptive edge AI capabilities.

Nanoveu Limited has completed the final tranche of its $3.02 million capital raising, with Chairman Dr David Pevcic investing $400,000 following shareholder approval. This funding round bolsters Nanoveu’s push in advanced semiconductor and 3D visualization technologies.

333D Limited reported a 12% increase in quarterly cash receipts from digital asset management contracts, maintaining steady cash flow despite slight operating cash usage. The company’s annual contract revenue surpassed $970,000, reflecting growing traction in healthcare digital services.

Nanoveu Limited has completed a $2 million capital raise through a strategic placement and exercised options, reinforcing its position in advanced semiconductor and 3D visualization technologies.

Nanoveu Limited has raised A$2 million through a strategic placement to accelerate the commercialisation of its 16nm ECS-DoT chip and expand its EMASS modular AIoT platform, positioning the company for global growth.

Nanoveu Limited has showcased its acquisition of EMASS and the breakthrough ECS-DoT system-on-chip technology, promising ultra-low-power AI processing with a notable 33% simulated flight time improvement in drones.

Nanoveu Limited has successfully completed the second tranche of its upsized capital raise, securing $720,000 through share issuance and listed options, with a final $400,000 tranche pending shareholder approval.

Nanoveu Limited has upsized its placement to $3.02 million, securing additional funding to fast-track the development and commercial rollout of its semiconductor, 3D visualisation, and solar coating technologies.