Latest Edge Ai News

BrainChip has launched its AKD2500 silicon development project, advancing its Akida™ 2.0 neuromorphic AI platform with a $2.5 million investment and prototype expected by Q3 2026.

BrainChip Holdings has bolstered its financial position with a A$35 million capital raise and commenced volume production of its AKD1500 neuromorphic AI chip, while deepening its strategic partnership with Parsons’ defence arm.

dorsaVi reports strong US commercial growth with over 100 new physical therapy sites and a 50% rise in cash receipts, alongside a strategic leadership change and breakthrough neuromorphic technology acquisition.

dorsaVi has launched a multi-year collaboration with leading Asian research institutes to develop its proprietary RRAM technology at the 22-nanometer node, targeting AI-driven robotics and wearable applications.

Nanoveu Limited has marked significant progress in its 16nm ECS-DoT edge-AI system-on-chip development, secured a strategic $7.5 million capital raise, and earned top honours at CES 2026, positioning itself for commercial breakthroughs in 2026.

Nanoveu’s subsidiary EMASS has successfully taped out its next-generation 16nm ECS-DoT ultra-low-power Edge AI system-on-chip, now entering production at TSMC. This milestone marks a significant step in scaling their proven 22nm platform to deliver enhanced performance and integration for always-on AI applications.

Nanoveu Limited has raised A$7.5 million through a strategic placement to accelerate the commercial rollout of its cutting-edge EMASS ECS-DoT semiconductor technology, including a rapid 16nm chip tape-out and live drone validation.

RocketBoots Limited has successfully raised A$7 million through a placement to accelerate its international expansion following a transformative global contract. The capital injection aims to scale its AI-driven loss-prevention platform and convert a robust enterprise pipeline.

Nanoveu Limited has announced the tape-out of its next-generation ECS-DoT 16nm integrated circuit, alongside key collaborations with Arrow Electronics and Semtech, signaling a strong push into the ultra-low-power Edge AI market.

Nanoveu’s subsidiary EMASS has completed the design phase of its cutting-edge 16nm ECS-DoT Edge AI system-on-chip, moving closer to fabrication and silicon validation that could redefine ultra-low-power AI at the edge.

Nanoveu’s subsidiary EMASS has teamed up with Semtech to integrate ultra-low-power AI with long-range LoRa connectivity, promising smarter, battery-efficient IoT devices for industrial and smart city applications.

DorsaVi reports significant progress in its resistive RAM (RRAM) development, optimizing memory technology for integration with neuromorphic computing at the 22nm technology node. This advancement positions the company to deliver energy-efficient edge-AI solutions for wearables, robotics, and industrial safety.