Latest Edge Ai News

Nanoveu Limited (ASX: NVU) is acquiring Singapore’s Spinoff Robotics, securing proprietary drone platforms and engineering talent to integrate its AI silicon with custom airframes. This vertical integration aims to propel Nanoveu into sovereign drone solutions for defence and critical infrastructure.

4DS Memory is accelerating commercialisation of its 60nm ReRAM technology in India, aligning with the country’s AUD$25 billion semiconductor investment and targeting mature-node industrial and defence sectors.

dorsaVi has secured a 12-month renewal of its Department of Defense-funded research with Georgia Southern University, advancing real-time gait optimisation to reduce military training injuries and laying groundwork for its exoskeleton and neuromorphic computing strategy.

BrainChip detailed significant progress in its neuromorphic AI technology and commercial strategy at its 2026 AGM, highlighting the AKD1500 chip launch and expanding defense and industrial collaborations.

dorsaVi has initiated its Ultra-Edge Modular Design program, transitioning from IP development to a manufacturable hardware platform targeting robotics, exoskeletons, and industrial AI with ultra-low power consumption.

BrainChip Holdings has signed a global IP license agreement with ASICLAND, enabling integration of its Akida neuromorphic AI technology into custom SoC designs with a royalty-based revenue model.

dorsaVi has launched a multi-year partnership with Taiwan’s ITRI and NTU to develop its proprietary RRAM platform at the 22-nm node, complemented by a new advisory board and neuromorphic IP acquisition, positioning the company at the forefront of ultra-edge AI hardware.

BrainChip Holdings has inked a global licensing agreement with Korea’s EDGEAI, granting access to its Akida 2 neuromorphic AI technology for EDGEAI’s upcoming semiconductor products. The deal includes milestone payments and royalties, marking a significant step in BrainChip’s global expansion and the growing edge AI market.

Nanoveu Limited showcased its cutting-edge EMASS semiconductor technology at the Pitt Street Research Semiconductor Conference 2026, spotlighting its ultra-low-power AI chips designed for next-gen smart devices and drones.

dorsaVi has initiated early-stage evaluation of resistive RAM (RRAM) test chips, marking a key step toward an advanced 22-nm memory platform designed to meet rising AI-driven demands in edge computing.

dorsaVi has formed a world-class Technical Advisory Board to accelerate its pioneering ‘Intelligence at the Ultra Edge’ strategy, integrating advanced memory and neuromorphic computing into robotics and healthcare devices.

Nanoveu’s subsidiary EMASS has unveiled a breakthrough reference design that integrates inertial sensing with edge AI to enable always-on, ultra-low-power voice interaction in hearable devices. This innovation promises to extend battery life while delivering real-time, hands-free voice control without cloud reliance.