Latest Edge Computing News

Harvest Technology Group reports it is one year ahead of its 3-Year Pathway to Profit plan, forecasting a significant reduction in EBITDA loss for FY25 and unveiling plans for its AI-powered NEON platform launch in 1H26.

Adisyn Ltd has successfully completed a key R&D program on low-temperature graphene deposition, earning full approval and final payment of a $520,000 grant from the Israel Innovation Authority. This milestone validates its cutting-edge semiconductor technology aimed at revolutionizing AI and high-performance computing.

DUG Technology has secured its inaugural commercial lease for the DUG Nomad, a cutting-edge mobile immersion cooling system, marking a key milestone in its edge computing ambitions.

Nanoveu Limited has successfully completed the second tranche of its upsized capital raise, securing $720,000 through share issuance and listed options, with a final $400,000 tranche pending shareholder approval.

Nanoveu’s subsidiary EMASS has hit a key milestone with its ECS-DoT chip achieving 50 updates per second in drone flight simulations, enabling smarter, more stable drones with up to 30% longer flight times.

DXN Limited has landed a significant A$2 million contract to supply two custom modular data centres to DP World’s Port Botany operations, marking its first engagement with the global logistics giant.

TZ Limited has received a second purchase order from Wesco Anixter on behalf of Microsoft, reinforcing its growing role in global data centre security deployments. The combined orders now total approximately AUD 585,000, highlighting strong momentum in TZ’s expansion across key international markets.

Nanoveu Limited has upsized its placement to $3.02 million, securing additional funding to fast-track the development and commercial rollout of its semiconductor, 3D visualisation, and solar coating technologies.

Nanoveu Limited has completed the first tranche of a $2.7 million capital raise, issuing over 61 million shares to bolster its advanced semiconductor and materials science ventures. Additional placements to executives and the Chairman are planned, pending shareholder approval.

Nanoveu Limited has expanded its capital raise to $2.7 million, led by a significant investment from CEO Mark Goranson and strong insider participation, to accelerate development across its semiconductor, 3D visualisation, and solar technology divisions.

Nanoveu Limited spotlighted its cutting-edge ultra-low-power AI semiconductor technology and strategic collaborations at the Pitt Street Research Semiconductor Conference 2025, signaling a bold push into edge AI markets.

Nanoveu Limited has successfully raised $2.3 million through a share placement to accelerate development and commercialization of its cutting-edge semiconductor, 3D visualization, and solar coating technologies.