Latest Nanoveu News

Nanoveu Limited has completed tape-out of its next-generation 16nm ECS-DoT AI chip, progressing its ultra-low-power edge AI commercialisation, while bolstering its drone systems capabilities through the Spinoff Robotics acquisition.

Nanoveu Limited (ASX: NVU) is acquiring Singapore’s Spinoff Robotics, securing proprietary drone platforms and engineering talent to integrate its AI silicon with custom airframes. This vertical integration aims to propel Nanoveu into sovereign drone solutions for defence and critical infrastructure.

Nanoveu Limited showcased its cutting-edge EMASS semiconductor technology at the Pitt Street Research Semiconductor Conference 2026, spotlighting its ultra-low-power AI chips designed for next-gen smart devices and drones.

Nanoveu’s subsidiary EMASS has unveiled a breakthrough reference design that integrates inertial sensing with edge AI to enable always-on, ultra-low-power voice interaction in hearable devices. This innovation promises to extend battery life while delivering real-time, hands-free voice control without cloud reliance.

Nanoveu Limited reported a dramatic revenue increase driven by its strategic acquisition of Embedded A.I. Systems, while losses widened as it invests heavily in semiconductor commercialisation. The company’s recent $7.5 million capital raise aims to fuel its next growth phase.

Nanoveu Limited has secured exclusive evaluation rights to four cutting-edge autonomous drone navigation technologies from Nanyang Technological University, aiming to advance GPS-free multi-drone coordination and endurance.

Nanoveu Limited has marked significant progress in its 16nm ECS-DoT edge-AI system-on-chip development, secured a strategic $7.5 million capital raise, and earned top honours at CES 2026, positioning itself for commercial breakthroughs in 2026.

Nanoveu Limited has successfully raised $7.38 million through a strategic placement, advancing its position in advanced semiconductor and material sciences. The capital injection supports ongoing development of its innovative AI-driven SoC solutions and antimicrobial technologies.

Nanoveu’s subsidiary EMASS has successfully taped out its next-generation 16nm ECS-DoT ultra-low-power Edge AI system-on-chip, now entering production at TSMC. This milestone marks a significant step in scaling their proven 22nm platform to deliver enhanced performance and integration for always-on AI applications.

Nanoveu Limited has raised A$7.5 million through a strategic placement to accelerate the commercial rollout of its cutting-edge EMASS ECS-DoT semiconductor technology, including a rapid 16nm chip tape-out and live drone validation.

Nanoveu Limited has announced the tape-out of its next-generation ECS-DoT 16nm integrated circuit, alongside key collaborations with Arrow Electronics and Semtech, signaling a strong push into the ultra-low-power Edge AI market.

Nanoveu’s subsidiary EMASS has completed the design phase of its cutting-edge 16nm ECS-DoT Edge AI system-on-chip, moving closer to fabrication and silicon validation that could redefine ultra-low-power AI at the edge.