Latest Nanoveu News

Nanoveu Limited showcased its cutting-edge EMASS semiconductor technology at the Pitt Street Research Semiconductor Conference 2026, spotlighting its ultra-low-power AI chips designed for next-gen smart devices and drones.

Nanoveu’s subsidiary EMASS has unveiled a breakthrough reference design that integrates inertial sensing with edge AI to enable always-on, ultra-low-power voice interaction in hearable devices. This innovation promises to extend battery life while delivering real-time, hands-free voice control without cloud reliance.

Nanoveu Limited reported a dramatic revenue increase driven by its strategic acquisition of Embedded A.I. Systems, while losses widened as it invests heavily in semiconductor commercialisation. The company’s recent $7.5 million capital raise aims to fuel its next growth phase.

Nanoveu Limited has secured exclusive evaluation rights to four cutting-edge autonomous drone navigation technologies from Nanyang Technological University, aiming to advance GPS-free multi-drone coordination and endurance.

Nanoveu Limited has marked significant progress in its 16nm ECS-DoT edge-AI system-on-chip development, secured a strategic $7.5 million capital raise, and earned top honours at CES 2026, positioning itself for commercial breakthroughs in 2026.

Nanoveu Limited has successfully raised $7.38 million through a strategic placement, advancing its position in advanced semiconductor and material sciences. The capital injection supports ongoing development of its innovative AI-driven SoC solutions and antimicrobial technologies.

Nanoveu’s subsidiary EMASS has successfully taped out its next-generation 16nm ECS-DoT ultra-low-power Edge AI system-on-chip, now entering production at TSMC. This milestone marks a significant step in scaling their proven 22nm platform to deliver enhanced performance and integration for always-on AI applications.

Nanoveu Limited has raised A$7.5 million through a strategic placement to accelerate the commercial rollout of its cutting-edge EMASS ECS-DoT semiconductor technology, including a rapid 16nm chip tape-out and live drone validation.

Nanoveu Limited has announced the tape-out of its next-generation ECS-DoT 16nm integrated circuit, alongside key collaborations with Arrow Electronics and Semtech, signaling a strong push into the ultra-low-power Edge AI market.

Nanoveu’s subsidiary EMASS has completed the design phase of its cutting-edge 16nm ECS-DoT Edge AI system-on-chip, moving closer to fabrication and silicon validation that could redefine ultra-low-power AI at the edge.

Nanoveu’s subsidiary EMASS has teamed up with Semtech to integrate ultra-low-power AI with long-range LoRa connectivity, promising smarter, battery-efficient IoT devices for industrial and smart city applications.

Nanoveu Limited has reported a major leap in drone endurance through its ultra-low-power AI chip technology, alongside advancing its next-generation 16 nm chip towards fabrication and expanding its U.S. sales network.