Latest Nanoveu News

Nanoveu Limited has completed a $2 million capital raise through a strategic placement and exercised options, reinforcing its position in advanced semiconductor and 3D visualization technologies.

Nanoveu Limited has raised A$2 million through a strategic placement to accelerate the commercialisation of its 16nm ECS-DoT chip and expand its EMASS modular AIoT platform, positioning the company for global growth.

Nanoveu Limited has showcased its acquisition of EMASS and the breakthrough ECS-DoT system-on-chip technology, promising ultra-low-power AI processing with a notable 33% simulated flight time improvement in drones.

Nanoveu’s subsidiary EMASS has reached a key milestone by moving its ECS-DoT AIoT chip into 16nm synthesis, while unveiling a Modular AIoT Development Kit to accelerate edge intelligence adoption.

Nanoveu’s subsidiary EMASS has demonstrated a 33% increase in simulated drone flight time using its ultra-low-power ECS-DoT AI chip, marking a significant step toward real-world drone autonomy and efficiency.

Nanoveu Limited has locked in a $500,000 funding guarantee through an options underwriting agreement, underpinning its push to commercialise cutting-edge semiconductor and 3D visualisation technologies.

Nanoveu Limited has successfully completed the second tranche of its upsized capital raise, securing $720,000 through share issuance and listed options, with a final $400,000 tranche pending shareholder approval.

Nanoveu’s subsidiary EMASS has hit a key milestone with its ECS-DoT chip achieving 50 updates per second in drone flight simulations, enabling smarter, more stable drones with up to 30% longer flight times.

Nanoveu’s subsidiary EMASS has launched real-world trials of its ECS-DoT AI chip, aiming to extend drone flight times by up to 30% while enabling advanced onboard intelligence with ultra-low power consumption.

Nanoveu Limited has increased its capital raise by $310,000, bringing the total placement to $3.02 million, with updated details on share and option issuances including conditional allocations to its Executive Chairman.

Nanoveu Limited has upsized its placement to $3.02 million, securing additional funding to fast-track the development and commercial rollout of its semiconductor, 3D visualisation, and solar coating technologies.

Nanoveu Limited has completed the first tranche of a $2.7 million capital raise, issuing over 61 million shares to bolster its advanced semiconductor and materials science ventures. Additional placements to executives and the Chairman are planned, pending shareholder approval.