Latest Nanoveu News

Nanoveu Limited has locked in a $500,000 funding guarantee through an options underwriting agreement, underpinning its push to commercialise cutting-edge semiconductor and 3D visualisation technologies.

Nanoveu Limited has successfully completed the second tranche of its upsized capital raise, securing $720,000 through share issuance and listed options, with a final $400,000 tranche pending shareholder approval.

Nanoveu’s subsidiary EMASS has hit a key milestone with its ECS-DoT chip achieving 50 updates per second in drone flight simulations, enabling smarter, more stable drones with up to 30% longer flight times.

Nanoveu’s subsidiary EMASS has launched real-world trials of its ECS-DoT AI chip, aiming to extend drone flight times by up to 30% while enabling advanced onboard intelligence with ultra-low power consumption.

Nanoveu Limited has increased its capital raise by $310,000, bringing the total placement to $3.02 million, with updated details on share and option issuances including conditional allocations to its Executive Chairman.

Nanoveu Limited has upsized its placement to $3.02 million, securing additional funding to fast-track the development and commercial rollout of its semiconductor, 3D visualisation, and solar coating technologies.

Nanoveu Limited has completed the first tranche of a $2.7 million capital raise, issuing over 61 million shares to bolster its advanced semiconductor and materials science ventures. Additional placements to executives and the Chairman are planned, pending shareholder approval.

Nanoveu Limited has launched a $2.7 million capital raising via a share placement and a substantial options offer, pending shareholder approval for securities issued to its Executive Chairman. The prospectus outlines key risks and the impact on the company’s capital structure.

Nanoveu Limited has expanded its capital raise to $2.7 million, led by a significant investment from CEO Mark Goranson and strong insider participation, to accelerate development across its semiconductor, 3D visualisation, and solar technology divisions.

Nanoveu Limited spotlighted its cutting-edge ultra-low-power AI semiconductor technology and strategic collaborations at the Pitt Street Research Semiconductor Conference 2025, signaling a bold push into edge AI markets.

Nanoveu Limited has successfully raised $2.3 million through a share placement to accelerate development and commercialization of its cutting-edge semiconductor, 3D visualization, and solar coating technologies.

Nanoveu Limited has completed its strategic acquisition of EMASS, advancing its foothold in ultra-low-power AI-driven edge computing. The company also strengthened its leadership team and secured additional capital to fuel growth.