Latest Nanoveu News

Nanoveu’s subsidiary EMASS has teamed up with Semtech to integrate ultra-low-power AI with long-range LoRa connectivity, promising smarter, battery-efficient IoT devices for industrial and smart city applications.

Nanoveu Limited has reported a major leap in drone endurance through its ultra-low-power AI chip technology, alongside advancing its next-generation 16 nm chip towards fabrication and expanding its U.S. sales network.

Nanoveu’s subsidiary EMASS has partnered with Arrow Electronics to accelerate the deployment of its ultra-low-power ECS-DoT edge AI chip, aiming to simplify always-on AI integration across multiple industries.

Nanoveu Limited showcased its cutting-edge EMASS semiconductor technology at the Ignite Investment Summit in Hong Kong, highlighting a new ultra-low-power AI chip designed to revolutionize edge computing across multiple industries.

Nanoveu’s subsidiary EMASS has initiated live flight tests using the Crazyflie nano-drone to validate simulation results showing over 50% endurance gains from its ECS-DoT AI chip. These trials aim to confirm real-world energy savings and autonomous navigation capabilities with minimal sensors.

Nanoveu Limited reveals significant progress in its ECS-DoT system-on-chip technology, showcasing a 60% average increase in drone flight endurance and advancing production with TSMC’s 16nm process. The company’s latest investor webinar highlights its growing OEM partnerships and disruptive edge AI capabilities.

Nanoveu’s subsidiary EMASS has demonstrated a remarkable leap in drone endurance using its ECS-DoT ultra-low-power AI chip, achieving average flight time extensions of 60% across multiple drone types in over 300 simulated trials.

Nanoveu Limited’s transformative half-year report highlights its EMASS acquisition, executive hires, and technology advances amid a $3 million loss and new US OTCQB listing.

Nanoveu, via its subsidiary EMASS, has expanded its U.S. sales network with key manufacturer representatives to fast-track adoption of its ECS-DoT ultra-low power Edge AI chip across critical OEM hubs.

Nanoveu Limited has completed the final tranche of its $3.02 million capital raising, with Chairman Dr David Pevcic investing $400,000 following shareholder approval. This funding round bolsters Nanoveu’s push in advanced semiconductor and 3D visualization technologies.

Nanoveu Limited advances its proprietary 16nm ECS-DoT chip fabrication, targeting completion by Q4 2025, supported by a strategic partnership and expanded engineering teams across multiple continents.

Nanoveu Limited has accelerated its commercial and technological momentum with a $3.02 million capital raise, a breakthrough 33% increase in drone flight time using its edge-AI chip, and progress toward a U.S. OTCQB listing.